Again, Rogers use organic binders that outgass. You have not specified what kind of application. What vacuum level? High voltage? Ion pumping capacity? DC or RF? Plasma, sputter, e-beam, spectrometry or what? Multilayer? Shielded? and so on... If it's possible, put the board in a hermetic metal can with glass feedtrues. Then you can use any material. As I said, we have no idea what you are designing. Best you could do is to phone American Advanced Ceramics Corp. http://www.momentive.com/Internet/Ceramics/ch.Product+Category.search?channelId=9b2c8c5982c2b110VgnVCM100000032415acRCRD Good Luck Inge On 29 July 2011 19:42, Kenneth J. Wood <[log in to unmask]> wrote: > what about TMM materials? > Ken > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord > Sent: Friday, July 29, 2011 1:33 PM > To: [log in to unmask] > Subject: Re: [TN] High Vacuum Substrate > > Ken, > you can't use organic substrates at 10exp-12 mBar. Use ceramic substrates. > The organic binder in RO3003 never stops outgassing. > . A typical Pyrex glass system may need as much as +400 Centigrade baking > and one week pumping to achieve 10exp-14, as a comparison. > All depends on the volume and the gaskets etc. (Maissel & Gang 2:102). > Inge > > On 29 July 2011 15:51, Kenneth J. Wood <[log in to unmask]> wrote: > > > Hi all, > > > > I have a PCB that operates inside a vacuum chamber under ultra high > vacuum. > > > > The material can't outgas and needs to hold up physically under the > > pressure > > (or lack thereof). > > > > I wanted to use RO3003 but may need something else, any suggestions? > > > > Material lead time is an issue as well which is why I'm looking... > > Thanks > > > > Ken > > > > _____________________________________ > > > > Kenneth J. Wood > > > > Saturn PCB Design, Inc. > > > > www.saturnpcb.com > > > > > > > > > > > > > > > > > > > > ______________________________________________________________________ > > This email has been scanned by the MessageLabs Email Security System. > > For more information please contact helpdesk at x2960 or > [log in to unmask] > > ______________________________________________________________________ > > > > --------------------------------------------------- > > Technet Mail List provided as a service by IPC using LISTSERV 16.0 > > To unsubscribe, send a message to [log in to unmask] with following text > in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt or (re-start) delivery of Technet send e-mail to > > [log in to unmask]: SET Technet NOMAIL or (MAIL) > > To receive ONE mailing per day of all the posts: send e-mail to > > [log in to unmask]: SET Technet Digest > > Search the archives of previous posts at: > http://listserv.ipc.org/archives > > For additional information, or contact Keach Sasamori at [log in to unmask] > > 847-615-7100 ext.2815 > > ----------------------------------------------------- > > > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 16.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > For additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 16.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > For additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------