| Thomas Wang <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]> 2011-06-24 16:18
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| Thomas Wang <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]> 2011-06-24 09:08
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| Thomas Wang <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]> 2011-06-23 18:01
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Please review the attachment, thanks!
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, June 23, 2011 4:42 PM
To: Asia Committe Task Group Forum; Thomas Wang
Subject: Re: [TGAsia] Wave 少锡和连焊困扰
I can not see the attached drawing.
Peter Zhou
Simclar Electronics (SuZhou) Co,. Ltd.
Block C#02-01/08, No.5 XingHan Street
SuZhou Industrial Park, 215021, SuZhou, P.R.China
Tel: +86 512 62521808 (Ext. 607)
Fax: +86 512 67618925
MP: 13913124061
E-mail: [log in to unmask]
| Thomas Wang <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]> 2011-06-23 16:38
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Hello Peter：
Thanks for your information!
For this product design reason, we can’t use selective solder for narrow
pitch between components!
SMD pad has hole as below:
High thickness body component as below:
Thomas Wang
KECN
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, June 23, 2011 11:19 AM
To: Asia Committe Task Group Forum; Thomas Wang
Subject: Re: [TGAsia] Wave 少锡和连焊困扰
Hello, Thomas:
Could u please kindly take some pictures for us?
According to your descrption, I'd like to suggest that you can think about
using selective solder.
Best Regards
Peter Zhou
Simclar Electronics (SuZhou) Co,. Ltd.
Block C#02-01/08, No.5 XingHan Street
SuZhou Industrial Park, 215021, SuZhou, P.R.China
Tel: +86 512 62521808 (Ext. 607)
Fax: +86 512 67618925
MP: 13913124061
E-mail: [log in to unmask]
| Thomas Wang <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]> 2011-06-23 09:42
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Hello all：
现有一个3级产品，SMT背面零件为红胶工艺并过Wave：
1 背面贴片零件的焊盘有过孔，Wave焊接后焊锡收缩到孔中，表现为少锡，已完全焊接，但不可接受
2 有一两边引脚的IC，紧随过锡位置有一比较高的零件，不易拖锡造成连焊（不可以改变方向过Wave，
很多类似的两边引脚的IC都有拖锡焊盘，包括该IC）
3 还是该产品，因零件密集且有如上的设计问题，尝试降低预热并降低Wave高度，可以减少少锡但连焊会大量增加，
升高预热并升高Wave高度，可以减少连焊但少锡会大量增加，比较郁闷，请各位赐教，谢谢！
Thomas Wang
KECN
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