Hello, Thomas: Could you please kindly tell me the shortest distance between PTH component's pins and SMD pads? If it is 1mm, it is too short. Best Regards Peter Zhou Simclar Electronics (SuZhou) Co,. Ltd. Block C#02-01/08, No.5 XingHan Street SuZhou Industrial Park, 215021, SuZhou, P.R.China Tel: +86 512 62521808 (Ext. 607) Fax: +86 512 67618925 MP: 13913124061 E-mail: [log in to unmask] Thomas Wang <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2011-06-24 16:18 Please respond to Asia Committe Task Group Forum <[log in to unmask]>; Please respond to Thomas Wang <[log in to unmask]> To <[log in to unmask]> cc Subject Re: [TGAsia] Wave 少锡和连焊困扰 Hello peter: Please review below, thanks! Thomas Wang From: [log in to unmask] [mailto:[log in to unmask]] Sent: Friday, June 24, 2011 9:46 AM To: Asia Committe Task Group Forum; Thomas Wang Cc: [log in to unmask] Subject: Re: [TGAsia] Wave 少锡和连焊困扰 Hello, Thomas: It is my honor to share my experience with you. Hopefully some data can be provided: 1. The height of the solder side's highest SMD components. About 2 mm 2. Lead-free process or Sn-pb process? Sn-Pb 3. Are there several top preheater in your wave machine? 2 top preheater, but not use for this product because of SMD insufficient 4. The board size: length X width X thickness 113 mm * 98 mm 5. The shortest distance between PTH parts and SMD components About 1 mm 6. Is your wave equipped with dual or single solder nozzle? Chip nozzle and main nozzle Best Regards Peter Zhou Simclar Electronics (SuZhou) Co,. Ltd. Block C#02-01/08, No.5 XingHan Street SuZhou Industrial Park, 215021, SuZhou, P.R.China Tel: +86 512 62521808 (Ext. 607) Fax: +86 512 67618925 MP: 13913124061 E-mail: [log in to unmask] Thomas Wang <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2011-06-24 09:08 Please respond to Asia Committe Task Group Forum <[log in to unmask]>; Please respond to Thomas Wang <[log in to unmask]> To <[log in to unmask]> cc Subject Re: [TGAsia] Wave 少锡和连焊困扰 Hello Peter： This is a transfer product from the customer, and their yield is low also, But they wish us to improve, so I want to get your support, thanks! Thomas Wang KECN From: [log in to unmask] [mailto:[log in to unmask]] Sent: Friday, June 24, 2011 9:01 AM To: Asia Committe Task Group Forum; Thomas Wang Subject: Re: [TGAsia] Wave 少锡和连焊困扰 Hello, Thomas: After verifying the attached picture, it seems that you have got the root cause. I suggest you had better check PCB design rule and then discuss it with your end user. Best Regards Peter Zhou Simclar Electronics (SuZhou) Co,. Ltd. Block C#02-01/08, No.5 XingHan Street SuZhou Industrial Park, 215021, SuZhou, P.R.China Tel: +86 512 62521808 (Ext. 607) Fax: +86 512 67618925 MP: 13913124061 E-mail: [log in to unmask] Thomas Wang <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2011-06-23 18:01 Please respond to Asia Committe Task Group Forum <[log in to unmask]>; Please respond to Thomas Wang <[log in to unmask]> To <[log in to unmask]> cc Subject Re: [TGAsia] Wave 少锡和连焊困扰 Please review the attachment, thanks! From: [log in to unmask] [mailto:[log in to unmask]] Sent: Thursday, June 23, 2011 4:42 PM To: Asia Committe Task Group Forum; Thomas Wang Subject: Re: [TGAsia] Wave 少锡和连焊困扰 I can not see the attached drawing. Peter Zhou Simclar Electronics (SuZhou) Co,. Ltd. Block C#02-01/08, No.5 XingHan Street SuZhou Industrial Park, 215021, SuZhou, P.R.China Tel: +86 512 62521808 (Ext. 607) Fax: +86 512 67618925 MP: 13913124061 E-mail: [log in to unmask] Thomas Wang <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2011-06-23 16:38 Please respond to Asia Committe Task Group Forum <[log in to unmask]>; Please respond to Thomas Wang <[log in to unmask]> To <[log in to unmask]> cc Subject Re: [TGAsia] Wave 少锡和连焊困扰 Hello Peter： Thanks for your information! For this product design reason, we can’t use selective solder for narrow pitch between components! SMD pad has hole as below: High thickness body component as below: Thomas Wang KECN From: [log in to unmask] [mailto:[log in to unmask]] Sent: Thursday, June 23, 2011 11:19 AM To: Asia Committe Task Group Forum; Thomas Wang Subject: Re: [TGAsia] Wave 少锡和连焊困扰 Hello, Thomas: Could u please kindly take some pictures for us? According to your descrption, I'd like to suggest that you can think about using selective solder. Best Regards Peter Zhou Simclar Electronics (SuZhou) Co,. Ltd. Block C#02-01/08, No.5 XingHan Street SuZhou Industrial Park, 215021, SuZhou, P.R.China Tel: +86 512 62521808 (Ext. 607) Fax: +86 512 67618925 MP: 13913124061 E-mail: [log in to unmask] Thomas Wang <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2011-06-23 09:42 Please respond to Asia Committe Task Group Forum <[log in to unmask]>; Please respond to Thomas Wang <[log in to unmask]> To <[log in to unmask]> cc Subject [TGAsia] Wave少锡和连焊困扰 Hello all： 现有一个3级产品，SMT背面零件为红胶工艺并过Wave： 1 背面贴片零件的焊盘有过孔，Wave焊接后焊锡收缩到孔中，表现为少锡，已完全焊 接，但不可接受 2 有一两边引脚的IC，紧随过锡位置有一比较高的零件，不易拖锡造成连焊（不可以 改变方向过Wave， 很多类似的两边引脚的IC都有拖锡焊盘，包括该IC） 3 还是该产品，因零件密集且有如上的设计问题，尝试降低预热并降低Wave高度，可 以减少少锡但连焊会大量增加， 升高预热并升高Wave高度，可以减少连焊但少锡会大量增加，比较郁闷，请各位赐教 ，谢谢！ Thomas Wang KECN ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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