These is a debate currently raging on internally on whether or not to allow X-outs on panelized assemblies. I am of the opinion to not allow any X-outs as this entails manual intervention on the line to not populate that particular board (we have not programmed any bad board sense into our programs), and to a lesser extent, leads to solderpaste wastage. Furthermore, to me, accepting X-outs means accepting a more variable (if not a out of control) process at the board house. However, I want to to hear to any opinions otherwise if any

What is the industry doing as a whole regarding X-outs?

Thanks,
Amol



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