These is a debate currently raging on internally on whether or not to allow X-outs on panelized assemblies. I am of the opinion to not allow any X-outs as this entails manual intervention on the line to not populate that particular board (we have not programmed any bad board sense into our programs), and to a lesser extent, leads to solderpaste wastage. Furthermore, to me, accepting X-outs means accepting a more variable (if not a out of control) process at the board house. However, I want to to hear to any opinions otherwise if any What is the industry doing as a whole regarding X-outs? Thanks, Amol ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------