If you are using a tin-lead process then you have no choice, call it rework or repair (maybe we need a new term thanks to this damned RoHS?) whatever... you must re-ball. SAC solder balls attached with SnPb are a no-no. I researched this a while ago and fortunately my BGA supplier (Lattice) was convinced to offer both SAC and SnPb. Fingers, toes and eyes remain crossed they won't change their mind! Bob Landman H&L Instruments, LLC Sent from my iPhone On Jun 1, 2011, at 3:21 PM, Gerald Bogert <[log in to unmask]> wrote: > June 1, 2011 > > > > Anyone have technical data to support (or not support) re-balling of > BGAs to change from SAC balls to Pb balls??? > > > > My understanding is that because of the extra heat cycle involved, BGA > manufacturers may not stand behind their part warranty if re-balling is > done. I also seem to recall a technical poster or paper presented at > IPC several years ago which I believe indicated a reduction in > reliability of the part if it is re-balled. > > > > Also seems to me that if one were to re-ball a BGA, this would be a > repair and not a reqork process and as such may require specific > customer approval. > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 16.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------