TechNetters,

It looks like my earlier query on the best practice to use for strapping two adjacent vias at the bottom of a BGA has been partcularly unsuccessful with no reply so far, which is quite unusual for the TechNet forum...
This message is only a reminder or a second chance...
Thanks for sharing your views on this topic.
Best regards, 

Arnaud Grivon
PCB/PCBA Technology Expert
Thales Corporate Services - EPM
18, avenue du Maréchal Juin
Bât. C - Bureau C2-135
92366 Meudon-la-Forêt Cedex
France
Tél : (+33) (0)1 70 28 23 88

-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de GRIVON Arnaud
Envoyé : mercredi 22 juin 2011 17:46
À : [log in to unmask]
Objet : [TN] [COM] Strapping Adjacent BGA Vias

Dear all,

What would the best repair process to use for strapping two adjacent vias of a 1mm-pitch BGA?
I did not find this situation in the IPC-7711/7721 standard.
Soldering a jumper wire in the two vias at the BGA bottom side looks risky because of the possibility of partially reflowing the BGA joints, but this may not be a real concern for a small wire.
Soldering a chip could be another option, but I am not sure this is an acceptable practice.
Insights welcome. Assume worst case, i.e. requirements to ensure high-reliability and harsh environment.
Thanks in advance.

A. Grivon


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