If not done properly, you might have spalling of old IMC as well. -------------------------- Sent using BlackBerry ----- Original Message ----- From: Joyce Koo [mailto:[log in to unmask]] Sent: Wednesday, June 01, 2011 06:02 PM To: [log in to unmask] <[log in to unmask]> Subject: Re: [TN] Re-balling BGAs Extra IMC at interface? Plus stress related to removal the old BGAs plus clean? -------------------------- Sent using BlackBerry ----- Original Message ----- From: Stadem, Richard D. [mailto:[log in to unmask]] Sent: Wednesday, June 01, 2011 05:43 PM To: [log in to unmask] <[log in to unmask]> Subject: Re: [TN] Re-balling BGAs Why would it be a repair? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerald Bogert Sent: Wednesday, June 01, 2011 2:22 PM To: [log in to unmask] Subject: [TN] Re-balling BGAs June 1, 2011 Anyone have technical data to support (or not support) re-balling of BGAs to change from SAC balls to Pb balls??? My understanding is that because of the extra heat cycle involved, BGA manufacturers may not stand behind their part warranty if re-balling is done. I also seem to recall a technical poster or paper presented at IPC several years ago which I believe indicated a reduction in reliability of the part if it is re-balled. Also seems to me that if one were to re-ball a BGA, this would be a repair and not a reqork process and as such may require specific customer approval. ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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