We've got a customer's PWB that has vias with the barrel either coated with solder mask or epoxy filled, then covered with solder mask. The plugging tends to leave a small protrusion above the copper surface. Some of these locations happen to be centered at MELF locations. During reflow, MELF's shift off the high point. Prevention / mitigation ideas anyone? Dick Krug, SSBB, CSMTPE SMT Process Engineer Sparton Corporation 30167 Power Line Road Brooksville, FL 34602-8299 p (352) 540-4012 (Internal Ext. 2012) [log in to unmask] ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------