Use low angle light and you will see everything (including something you do not want to know about). My 2 cents. Good luck. -----Original Message----- From: Forrester, Michael (H USA) [mailto:[log in to unmask]] Sent: Thursday, June 16, 2011 11:14 AM To: Joyce Koo; TechNet E-Mail Forum Subject: RE: PCBA Inspection for Solder Balls/Splashes I think it was the stencil not being clean. But the real question is, per IPC-A-610E is this considered a defect, since you can not see the solder "anomalies" without magnification? Best Regards, Michael Forrester Sr. Product Engineer CSMTPE Siemens Healthcare Diagnostics 101 Silvermine Rd. Brookfield, CT 06804 PH: (203) 740-6452 -----Original Message----- From: Joyce Koo [mailto:[log in to unmask]] Sent: Thursday, June 16, 2011 11:11 AM To: Forrester, Michael (H USA); TechNet E-Mail Forum Subject: RE: PCBA Inspection for Solder Balls/Splashes Webing ususally are very large, same goes with splashes. Look like your solder mask may not be cured properly (or your stencil is not cleaned at bottom). -----Original Message----- From: Forrester, Michael (H USA) [mailto:[log in to unmask]] Sent: Thursday, June 16, 2011 11:06 AM To: Joyce Koo; TechNet E-Mail Forum Subject: RE: PCBA Inspection for Solder Balls/Splashes 1st sentence in section 5.2.7.3 Soldering Anomalies - Excess Solder- Solder Webbing/Splashes: "Inspection for solder splashes shall be done without magnification." Best Regards, Michael Forrester Sr. Product Engineer CSMTPE Siemens Healthcare Diagnostics 101 Silvermine Rd. Brookfield, CT 06804 PH: (203) 740-6452 -----Original Message----- From: Joyce Koo [mailto:[log in to unmask]] Sent: Thursday, June 16, 2011 10:36 AM To: 'TechNet E-Mail Forum'; Forrester, Michael (H USA) Subject: RE: PCBA Inspection for Solder Balls/Splashes I thought table 1-2 and 1-3 specified Mag. I didn't know anything about no-mag. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Forrester, Michael (H USA) Sent: Thursday, June 16, 2011 10:24 AM To: [log in to unmask] Subject: [TN] PCBA Inspection for Solder Balls/Splashes I have a question about solder balls/splashes on PCBAs. in IPC-A-610E section 5.2.7.1 it mentions that solder balls and "fines" that are NOT encapsulated in flux is a defect. Section 5.2.7.3 mentions that the inspection for said solder anomalies shall be done with NO magnification. We have an SMT assembly that is manufactured with water soluble flux and has two SMT parts hand soldered to the board with No-Clean. In reviewing the rework under magnification, we discovered solder slivers entrapped in the No-Clean flux that did not violate the minimal electrical clearance. So far so good. I have several assemblies where there are unmelted solder balls from the paste and solder slivers (4-5 mils) spread all over the PCB NOT entrapped in any flux. I can not see them without magnification, so does that mean that they pass the IPC-A-610E specification? In thinking about this, in theory, once the board is put into service all of the solder anomalies, not entrapped in flux, could shake loose, converge and create a short? So hence my confusion between section 5.2.7.1 and 5.2.7.3. Any thoughts would be appreciated. Thank you. Best Regards, Michael Forrester Sr. Product Engineer CSMTPE Siemens Healthcare Diagnostics 101 Silvermine Rd. Brookfield, CT 06804 PH: (203) 740-6452 ------------------------------------------------------------------------ ------- This message and any included attachments are from Siemens Healthcare Diagnostics and are intended only for the addressee(s). 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