I have a question about solder balls/splashes on PCBAs. in IPC-A-610E section 5.2.7.1 it mentions that solder balls and "fines" that are NOT encapsulated in flux is a defect. Section 5.2.7.3 mentions that the inspection for said solder anomalies shall be done with NO magnification. We have an SMT assembly that is manufactured with water soluble flux and has two SMT parts hand soldered to the board with No-Clean. In reviewing the rework under magnification, we discovered solder slivers entrapped in the No-Clean flux that did not violate the minimal electrical clearance. So far so good. I have several assemblies where there are unmelted solder balls from the paste and solder slivers (4-5 mils) spread all over the PCB NOT entrapped in any flux. I can not see them without magnification, so does that mean that they pass the IPC-A-610E specification? In thinking about this, in theory, once the board is put into service all of the solder anomalies, not entrapped in flux, could shake loose, converge and create a short? So hence my confusion between section 5.2.7.1 and 5.2.7.3. Any thoughts would be appreciated. Thank you. Best Regards, Michael Forrester Sr. Product Engineer CSMTPE Siemens Healthcare Diagnostics 101 Silvermine Rd. Brookfield, CT 06804 PH: (203) 740-6452 ------------------------------------------------------------------------------- This message and any included attachments are from Siemens Healthcare Diagnostics and are intended only for the addressee(s). The information contained herein may include trade secrets or privileged or otherwise confidential information. Unauthorized review, forwarding, printing, copying, distributing, or using such information is strictly prohibited and may be unlawful. If you received this message in error, or have reason to believe you are not authorized to receive it, please promptly delete this message and notify the sender by e-mail with a copy to [log in to unmask] ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------