These recorded webinars are now available in the IPC online store. Click through the links below to purchase and view these audio visual sources. PDWEB10-BGAFAN<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=a8ee83e0-496c-e011-81fb-00155d05284b> Effective BGA Fanouts Choosing the appropriate fanout patterns for routing large BGAs can enable fewer layers, better signal integrity and lower costs. When using HDI, there are many options available which sometimes make the task daunting. This session is intended for PCB designers who want to find effective fanout methods for large, dense BGAs - and for those who are testing the HDI waters due to increased pin density. The principles for effective fanouts, independent of particular PCB design software, will be explored along with a demonstration of special software for this task in Expedition PCB. This webinar was given on August 26, 2010 by Charles Pfeil, Mentor Graphics. It includes synchronized audio and slides. 57 minutes. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available. IPC Member Price $75.00 Nonmember Price $100.00 PDWEB10-ESDPROTECT<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=7a982227-3c6f-e011-8c9a-00155d05284b> ESD Protection: The Next Generation Integrated circuits (ICs) are becoming more sensitive to electrostatic discharge (ESD). Semiconductor manufacturers are finding it increasingly difficult to build ESD protection into the next generation of devices. ESD protection issues pose a serious potential problem for the users of semiconductor devices. User ESD programs must be reviewed and updated to ensure the devices are not damaged during handling. What you will learn * Trends in ESD sensitivity levels * Problems handling the next generation of devices * Possible solutions that will allow your company to handle devices today, and in the future This downloadable webinar includes synchronized audio and slides. It was presented on June 22, 2010, by Ron Gibson of SH&A. 1 hour 10 minutes. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available. IPC Member Price $75.00 Nonmember Price $100.00 PDWEB10-MOISTURE<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=fa2d34f2-586f-e011-8c9a-00155d05284b> Controlling Moisture Content in Boards: Best Practices Reliability of printed circuit board (PCB) materials is strongly influenced by the presence of moisture. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in PCB manufacturing or diffuse into the PCB during storage. Moisture can reside in the resin, resin/glass interfaces and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake as compared to eutectic tin lead reflow processes. This webinar was given on July 28, 2010 by Bhanu Sood, CALCE. 1 hour 15 minutes. This downloadable webinar includes synchronized audio and slides. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available. What you will learn * Governing models and dependant variables of the moisture diffusion process * Effects of moisture on various susceptible components of a PCB (epoxy matrix, interfaces, vias, traces, solder masks, overcoats, etc.) and associated failure modes and mechanisms * PCB material handling and storage guidelines IPC Member Price $75.00 Nonmember Price $100.00 PDWEB10-PCBMOIST<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=2ff74f14-6b6f-e011-8c9a-00155d05284b> Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials Printed circuit board laminate datasheets provide permittivity (dielectric constant, Dk) and loss tangent (dissipation factor, Df) values that are used for specification and board design. But past studies have shown that these properties vary with changes in the moisture content of the PCB laminate material. Major problems can arise when material substitutions are made using laminate datasheets as a guide, especially when the data is derived using dissimilar test conditions or methods. For example, initial impedance calculations on the basis of datasheet values may be acceptable, but actual board performance may be significantly different and may result in poorly functioning and unreliable boards. This webinar will discuss the results of an experimental study to establish whether the preconditioning steps outlined in the IPC-TM-650 2.5.5.9 (Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz) test standard account for varying moisture contents in PCB laminate test coupons. The moisture content in a PCB material may vary because of material constituents, board design or handling, processing, shipping and end use conditions. Results also shed light on the dependence of dielectric values on moisture content and type of flame retardant used. Commercially available PCB materials sourced from two manufacturers were tested in this study. Materials were classified on the basis of flame retardant type (halogenated or halogen-free) and glass transition temperature. Extent of variation in the dielectric properties is discussed as a function of material constituents and moisture content. Types of materials that are most affected-and reasons behind the variation-are also reviewed. 59 minutes. Released 2010. This downloadable webinar includes synchronized audio and slides. It was presented by Bhanu Sood, CALCE. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available. IPC Member Price $75.00 Nonmember Price $100.00 PDWEB10-PROFILE<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=c65a9591-486f-e011-8c9a-00155d05284b> Non-Destructive Profiling Methods In this downloadable webinar, Brian O'Leary of KIC discusses a recent study by KIC and the Rochester Institute of Technology on reliable non-destructive methods for profiling sensitive critical components such as BGAs. 55 minutes. Released 2010. What You Will Learn * How to create off-sets for components that cannot be compromised for profiling purposes * How to create an in-spec profile for a brand-new PCB * How to create profiles without attaching thermocouples * How to balance complex PCBs (i.e. PCBs with forward/backward compatibility issues/hybrid PCBs) This webinar includes synchronized audio and slides. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available. IPC Member Price $75.00 Nonmember Price $100.00 PDWEB10-SIGNALINT<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=ae6e2f42-6e6f-e011-8c9a-00155d05284b> What Every Layout Designer Needs to Know About Signal Integrity This webinar was given on July 29, 2010 by Eric Bogatin, Ph.D, Bogatin Enterprises. Choices made in board layout strongly affect signal integrity. Discover the solutions to the top five problems designers encounter. This webinar will cover practical design guidelines you can use. 1 hour 5 minutes. Released 2010. What You Will Learn * How to minimize ground bounce * How to optimize differential pairs * How to build a robust power distribution network * Tips for achieving EMC certification. This downloadable webinar includes synchronized audio and slides. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available. IPC Member Price $75.00 Nonmember Price $100.00 PDWEB10-5704<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=c5ebc7b4-3e6c-e011-81fb-00155d05284bb> How Clean is Clean: What You Need to Know about the new IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards, is the first major IPC specification to detail cleanliness requirements for printed boards based on ion chromatography. This presentation discusses the IPC-5704 document and attendant IPC Test Method 2.3.28.2. Fabricators can expect to see these requirements as they use IPC bare board standards. Other associated IPC specifications in the IPC-57XX series are outlined. In addition, a brief history of bare board ionic cleanliness testing is discussed. 1 hour 4 minutes. This downloadable webinar includes synchronized audio and slides. It was presented by noted cleaning expert and IPC Cleaning and Coating Committee Chairman Doug Pauls of Rockwell Collins. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available. IPC Member Price $75.00 Nonmember Price $100.00 Kimberly Sterling, CAE Vice President, Marketing and Communications IPC - Association Connecting Electronics Industries 3000 Lakeside Drive Suite 309 S Bannockburn, IL 60015-1249 USA +1 847-597-2805 tel +1 847-615-5605 fax [log in to unmask] www.ipc.org -------------------------------------------------------------------------------- IPC_New_Releases Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF IPC_New_Releases Search previous postings at: http://listserv.ipc.org/archives/index.html Please visit IPC web site (www.ipc.org > Knowledge > Email Forums) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------