大哥大姐,你们发这个邮件能不能不要BCC给我?

我都不知道你们是发错了还是怎么搞的那也不用BCC吧!!!!!!

 

 

Hi Sherry,

 

了解到有些公司用30%，有些用50%作管控，供参考。

应考虑零件的作用，可以和客户协商规定。

 

 

Hi Sonic

 

零件焊接后没有偏移,只是在X-RAY检验时发现有空洞现象，所以想请教一下，这类元件焊接后空洞的判定标准为多少？

From: Sonic Lu [mailto:[log in to unmask]]
Sent: Friday, April 22, 2011 09:31
To: [log in to unmask]
Subject: Re: [TGAsia] 检验标准确认

1.BGA的气泡标准不是IPC-A-610
2.BGA的气泡标准是IPC-7095
3.没有焊球的就不能用BGA的标准
4.建议还是使用IPC-A-610,以零件焊接后是否偏移以及偏移的多少为判定标准
 
Thanks and Best Regards

Sonic Lu 陆尚
Process Engineer
Autoliv Electronics China (ACE) Co.,Ltd
Tel:  +86-21-67109300-3162

Sherry Ma <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2011-04-22 08:36 Please respond to Asia Committe Task Group Forum <[log in to unmask]>; Please respond to Sherry Ma <[log in to unmask]>

To <[log in to unmask]> cc   Subject [TGAsia] 检验标准确认

Dear all:
 
向各位请教一下，如图所示的零件（零件下没有焊球），像这类零件是否可以按IPC-A-610上BGA的标准来检查焊接气泡。
 
如果不能用BGA的焊接要求来判定的话，我们应该用什么标准来判定呢？
 
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Regards！
Sherry

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