Hi Sherry,

 

了解到有些公司用30%，有些用50%作管控，供参考。

应考虑零件的作用，可以和客户协商规定。

 

Thank you with Best Regards!

Petrel    Tel: 86-756-5322318

________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Sherry Ma
Sent: Friday, April 22, 2011 9:55 AM
To: [log in to unmask]
Subject: Re: [TGAsia] 检验标准确认

 

Hi Sonic

 

零件焊接后没有偏移,只是在X-RAY检验时发现有空洞现象，所以想请教一下，这类元件焊接后空洞的判定标准为多少？

 

Thanks！

Sherry

 

________________________________

From: Sonic Lu [mailto:[log in to unmask]] 
Sent: Friday, April 22, 2011 09:31
To: [log in to unmask]
Subject: Re: [TGAsia] 检验标准确认

1.BGA的气泡标准不是IPC-A-610 
2.BGA的气泡标准是IPC-7095 
3.没有焊球的就不能用BGA的标准 
4.建议还是使用IPC-A-610,以零件焊接后是否偏移以及偏移的多少为判定标准 
 
Thanks and Best Regards

Sonic Lu 陆尚
Process Engineer
Autoliv Electronics China (ACE) Co.,Ltd
Tel:  +86-21-67109300-3162 



Sherry Ma <[log in to unmask]> 
Sent by: TGAsia <[log in to unmask]> 

2011-04-22 08:36 

Please respond to
Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
Sherry Ma <[log in to unmask]>

To

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cc

 

Subject

[TGAsia] 检验标准确认

Dear all: 
 
向各位请教一下，如图所示的零件（零件下没有焊球），像这类零件是否可以按IPC-A-610上BGA的标准来检查焊接气泡。 
  
如果不能用BGA的焊接要求来判定的话，我们应该用什么标准来判定呢？ 
  
    
  
Regards！ 
Sherry 


  
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