应该是外来物,有点像助焊剂残留

可以试着加温,如果能融化,则可以肯定是助焊剂.


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Delstone Zhang(张伟) CTI <[log in to unmask]>
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2011-04-15 14:27
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[TGAsia] 答复: [TGAsia] PCB工艺产生白胶不良





其实做些模拟验证 或对出现问题的产品做一个焊接异常分析,是可以找出问题所在的。
 
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发件人: TGAsia [mailto:[log in to unmask]] 代表 tevin_zhang
发送时间:
2011年4月15日 14:12
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[TGAsia] 答复: [TGAsia] PCB工艺产生白胶不良

 
这是PCB原材的问题,光板上有异物,导致锡膏较厚,才造成这种缺陷。从图片上看异物是在印刷Solder Mask后才沾上的,请查一下内部的Handling和让供应商查一下他们印刷Mask后的管控。
 

 
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发件人: TGAsia [mailto:[log in to unmask]] 代表 Wen Zhong 钟文
发送时间:
2011年4月15日 13:53
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[TGAsia] 答复: [TGAsia] 答复: [TGAsia] PCB工艺产生白胶不良

 
我觉得象是REFLOW内滴下来的异物。
Sorting原材的PCB不就可以看到是否为原材异物?
 


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发件人: TGAsia [mailto:[log in to unmask]] 代表 Jason Tang
发送时间:
2011年4月15日 13:26
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[TGAsia] 答复: [TGAsia] PCB工艺产生白胶不良

 
从图片上看为返修产品,正常Reflow焊点不会是这样,应该跟你的制程有很大关系
 

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发件人: TGAsia [mailto:[log in to unmask]] 代表 Wang Xiaojin (AE/MOE2.3-CN)
发送时间:
2011年4月15日 13:11
收件人:
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主题:
Re: [TGAsia] PCB工艺产生白胶不良

 
Hello all:
 
请教大家,PCB生产工艺中有哪些环节会造成如下图所示的白色胶状物的不良.(我们现在SMT生产过程中发现很多这种不良,而且有些引起多锡了,所以现在觉得应该是PCB来料就有的)
谢谢大家!
 
 

 
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