Dear Ferris

 

內存條供應商全世界最大的二家 SAMSUNG & Hynix

其規格就是 30 ~ 35 u”

 

BR

Leo

 

 

Dear Leo,

谢谢！
内存条电镀金的规格是否有业界标准可以参考，非常想看到是否有做过相关的比较分析，为何内存条电镀金选择30U",其厚度与长时间使用可靠性是否可建立大致的量化关系。
******************************************************    
    Ferris Huang (黄斐玉)
    Desktop PC Development Lab (China), Lenovo  
    Tel:(010)58869204(office)
    E-mail:[log in to unmask]

******************************************************

黃志宏 經理 Leo <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2011-03-18 15:00 Please respond to Asia Committe Task Group Forum <[log in to unmask]>; Please respond to 黃志宏 經理 Leo <[log in to unmask]>

To [log in to unmask] cc   Subject Re: [TGAsia] 答复: [TGAsia] Immersion go  ld -  gold thickne ss

Dear Ferris
 
確實是有差異的.此種PCB的設計應該要使用電鍍金方式製作
電鍍金較硬故在插拔過程中不易產生嚴中刮痕.且長時間使用後
的信賴性會比較好.金厚越厚保護能力越好.但是價格越高
故建議G/F PCB 其金手指厚度至少要達到15U”這樣信賴性會較佳.
30 U” 一般多適用在內存條上的規格.
 
BR
Leo
 

 

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Feiyu1 Huang
Sent: Friday, March 18, 2011 2:25 PM
To: [log in to unmask]
Subject: Re: [TGAsia] 答复: [TGAsia] Immersion go ld - gold thickne ss
 

电连接器的接口电镀金厚度与可靠性的关系是什么？
例如内存金手指厚度电镀金15U"与30U"是否在可靠性上存在很大的差异？
******************************************************    
   Ferris Huang (黄斐玉)
   Desktop PC Development Lab (China), Lenovo  
   Tel:(010)58869204(office)
   E-mail:[log in to unmask]

******************************************************

黃志宏 經理 Leo <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2011-03-18 14:14   Please respond to Asia Committe Task Group Forum <[log in to unmask]>; Please respond to 黃志宏 經理 Leo <[log in to unmask]>

To [log in to unmask] cc   Subject Re: [TGAsia] 答复: [TGAsia] Immersion go ld - gold thickne ss

一般來說化金製程的厚度多為1~5U”之間此種規格最多
但是實際上若要焊錫性不錯且不易產生可靠度問題.則
建議規格為1~3u”.
超過3U”以上在化金製作過程中.化金時間較長鎳層就比較
容易被攻擊..後續問題就會比較多一點
 

 

From: TGAsia [mailto:[log in to unmask]] On Behalf Of YangYanBo
Sent: Friday, March 18, 2011 1:47 PM
To: [log in to unmask]
Subject: [TGAsia] 答复: [TGAsia] Immersion gold - gold thickne ss
 
Normally 2-5u''
 
 
 

 

发件人: TGAsia [mailto:[log in to unmask]] 代表 Patricia Lui
发送时间: 2011年3月17日 8:31
收件人: [log in to unmask]
主题: [TGAsia] Immersion gold - gold thickness

Dear PCB manufacturers and friends,   I have a query on the Immersion gold gold thickness, can you advise me what is the standard or most common gold thickness you are making if your customer do not have any high gold thickness requirements. Because I noticed that most PCB supplier will advise 1u"-3u" but the actual gold thickness is slightly >1u" only. It have never near to 2u". My customers had advised me that to meet IPC class 2 immersion gold boards gold thickness have to meet minmum 2u". Please advise are you also making mostly 1u"-3u" actual slightly >1u"? is this acceptable and the common practice?   Hope to have your favourable advise.   Thansk & Best Regards Patricia Lui Xuan Technologies

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