Dear Steve, Yes you are right. Thanks a lot Rgds pradeep -----Original Message----- From: Steve Gregory [mailto:[log in to unmask]] Sent: Monday, March 14, 2011 5:43 PM To: 'TechNet E-Mail Forum'; 'Pradeep M' Subject: RE: [TN] Delam after thermal cycling Hi Pradeep, I have your picture posted here: http://stevezeva.homestead.com/Delam.jpg I added the yellow arrows where I think you're showing us the delam. The larger light areas I'm assuming is conformal coating. Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Pradeep M Sent: Monday, March 14, 2011 5:53 AM To: [log in to unmask] Subject: Re: [TN] Delam after thermal cycling Yes Stephen. Why not? I will send the image to u -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Monday, March 14, 2011 3:09 PM To: [log in to unmask] Subject: Re: [TN] Delam after thermal cycling Pradeep, Would you like for me to post the photo on my web page for all to see? Steve -----Original Message----- From: Pradeep M Sent: Monday, March 14, 2011 5:24 AM To: [log in to unmask] Subject: [TN] Delam after thermal cycling Dear technetters, We are from a PCB mfg organization. One of our customers has made an observation on one of the boards that we had supplied to them earlier. This is a 6 layer card which we had manufactured in July 2007. This board does not have solder mask and has normal HASL as the surface finish. The customer had taken this up for manual assembly with hand soldering after some time. Typically with this customer, the whole assembly usually takes nothing less than 6-8 months for completion. They had completed the assembly and had subjected the assembled board for thermal cycling ( a procedure which they follow). Thermal cycling is being done at 60 deg C for 2.5 Hrs then at 13 degC for 2.5 Hrs for five cycles. After this the assembled board has been coated with conformal coating. Some more functional tests were conducted and this card is integrated together with other boards. Then a hot and cold storage test as part of test and evaluation (T&E) of the package was done. Storage test (passive ) is at the same extremes but active at 40 deg C. The customer had opened the package for correcting an anomaly observed, when they found some 'delamination' on the board. The customer has sent a photograph and wants us to respond with our comments. Customer says the board was looking fine after assembly as well as after the first thermal cycling. We are quite surprised on how a delamination can happen at max of 60 deg C. We do a microsection analysis of every processed panel and also does a thermal stress as per IPC TM 650 prior to the dispatch. We have asked for the actual board to ascertain the delamination, but this might take some time. The conformal coating material removed by peel off manually by the customer. We had used Nelco 4000-6 170 Tg FR4 material. Can anybody provide us some inputs. The photograph may be shared directly. Rgds Pradeep ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------