Carl, Forget the routed slots, reduce overall panel size and go direct to V-score 100% Cost will be reduced as you have already specified V-score in one direction. Routing will still take place on the 4 panel edges. Colin --- On Tue, 4/1/11, Phil Bavaro <[log in to unmask]> wrote: From: Phil Bavaro <[log in to unmask]> Subject: Re: [TN] Looking for guidance on specifying panel of small PC boards To: [log in to unmask] Date: Tuesday, 4 January, 2011, 1:02 Hi Carl, First I would recommend that you get yourself a copy of Kwick-fit panelization software. I will send you independently what I came up with in just five minutes .....your panel (16 up) is going to cost you a lot more than it could. Your approach is very similar to a lot of designs I have seen in the past....but just keep in mind that depaneling is not something that you should consider only in afterthought. You have definitive keep out for chips with respect to scored edges, etc. Pizza cutters are the commonly accepted method of depaneling scored arrays..... Phil -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Carl VanWormer Sent: Monday, January 03, 2011 4:16 PM To: [log in to unmask] Subject: [TN] Looking for guidance on specifying panel of small PC boards I have created a file ( http://www.cipher.com/Panelization02.jpg) that is my guess at a PCB panel that will meet the following goals. 1. A bunch of boards to reduce handling costs. 2. Not too much waste. 3. Side rails to keep the system from being too "wobbly" (that's a technical term). 4. Routed slots between boards to minimize twisting forces during hand de-paneling. The circuit boards will be made from .062" FR-4, and are each 2.875"x1.125". the surface mounted parts will be placed, then fed to the IR re-flow oven for the first pass of processing. Then, the through-hole connectors will be added at both ends of each board and the panel will be wave soldered to attach the connectors. The board will go through the wave in the direction of the long axis. My picture has interior single lines representing V-Scores, and thick gray lines representing routed slots between pairs of boards. My goal is for hand separation of the boards, with minimal forces on the chips on the interior of the board area. My hope is that one of the long side rails (green) can be broken off, then each pair of boards can be snapped from the other long side rail (green), then the pairs of boards can be snapped apart. I am making a lot of guesses from things I've seen before. I'm looking for guidance on how to specify panels that will be considered "good" by all parties involved in the processing chain. Are there published documents that can help me look like an expert (without too much work on my part)? Thanks, Carl Carl Van Wormer, P.E., AE7GD Senior Hardware Engineer Cipher Systems 1800 NW 169th Place, Suite B-100 Beaverton, OR 97006 Cipher Systems (503) 617-7447 x 5163 Direct Line (503) 425-5163 [log in to unmask] <mailto:[log in to unmask]> This message may contain confidential and/or proprietary information, and is intended for the person/entity to whom it was originally addressed. Any use by others is strictly prohibited. If I sent this to you by mistake, please be nice and delete it, then tell me of my mistake so I can send it to the right person. ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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