I think a datacon machine could probably do what you want but unless you want to do 10X10^6 parts you may find their stuff a bit expensive, somewhere in the region of $400K. Of course they may give you a contact for someone who could do it for you. http://www.datacon.at/ On 19/01/2011 15:09, Steven Creswick wrote: > Ioan, > > I'm not up to snuff on SMT pick and place machines, but this type of process > can typically be handled by most Flip Chip bonders. If using flux, one > needs to make sure the level of flux/depth of immersion is consistent and > controlled. > > You might just try to do a Google search for those [Flip Chip Bonders& POP, > for example]. I am sure that the Amkor's, STATpac's, and Tessera's of the > world are using standard equipment. > > There are also lab model flip chip bonders [manual] that can do this in a > low volume developmental phase > > A few automatic machine suppliers to look into - > http://www.datacon.at/ > > http://www.panasonicfa.com/?id=advanced%20packaging%20lab > > and a few other company names that come to mind > > Siemens > > KME > > Shinkawa > > K&S > > F&K > > H&K > > You might search archives in ChipScale review magazine for further equipment > info and references. They typically publish equipment supplier summaries on > the various types of bonders used in microelectronics assy. I don't happen > to have one at my fingertips, but if you absolutely can not find one, let me > know - > > http://www.chipscalereview.com/issues/0109/index.php > > You could do the same with Advanced Packaging - > http://www.electroiq.com/index/packaging.html > > Or Solid State Technology magazine - > http://www.electroiq.com/index/Semiconductors/sst-past-issues.html > > > > > > > > Manual FC bonders - http://www.finetechusa.com/ > > http://www.norana.com.tr/MicroAssembly.htm > > > Possibly the Surface mount industry has something to do this, but I lean > back into familiar territory. > > Regards > > > Steve Creswick > http://www.linkedin.com/in/stevencreswick > > > > > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea > Sent: Wednesday, January 19, 2011 9:21 AM > To: [log in to unmask] > Subject: [TN] Handling of PoP on assembly equipment > > Dear Technos, > > > > I need to know how package on package is assembled in real life. Attended > Bob Willis' course and found it very good, it's just that neither of our > Mudata or Fuji IP3 machines are able to handle this process > (pick-dip-place). > > > > So, how are you doing it? Which insertion machines can handle the process > and if you do it in an automatic-manual manner, how do you go about it? > > > > Thanks, > > > > Ioan Tempea, ing. > Ingénieur Principal de Fabrication / Senior Manufacturing Engineer > T | 450.967.7100 ext.244 > E | [log in to unmask]<mailto:[log in to unmask]> > W | www.digico.cc<http://www.digico.cc/> > > > N'imprimer que si nécessaire - Print only if you must > > > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site > http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 > ext.2815 > ----------------------------------------------------- > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > . > -- Eric Christison Consumer& Micro group Imaging Division STMicroelectronics (R&D) Ltd 33 Pinkhill Edinburgh EH12 7BF United Kingdom Tel: +44 (0)131 336 6165 Fax: + 44 (0)131 336 6001 The contents of the email are ST confidential. ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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