一般电镍的目的是为了镀金，已提高可焊性；
PCB or 材料的表面处理只是镀镍，应该没有这样的工艺吧！
Best regards and thanks
Nancy Deng
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Tommy Wang [LTBJ]
Sent: Thursday, December 02, 2010 4:55 PM
To: [log in to unmask]
Subject: [TGAsia] 请教
请教各位，是不是镀镍的表面可焊性就会稍差一些，而且焊锡流动和湿润不好？
Best regards!
MAS Product Engineer
Laird Technologies(
No.14,
100176,
英资莱尔德无线通信技术（北京）有限公司
中国北京市经济开发区锦绣街14号（100176）
Phone:+86 10 5933 3471
Mobile:+86 15011516577
E-mail:[log in to unmask]
Website:www.lairdtech.com
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