一般电镍的目的是为了镀金,已提高可焊性; PCB or 材料的表面处理只是镀镍,应该没有这样的工艺吧! Best regards and thanks Nancy Deng From: TGAsia [mailto:[log in to unmask]] On Behalf Of Tommy Wang [LTBJ] Sent: Thursday, December 02, 2010 4:55 PM To: [log in to unmask] Subject: [TGAsia] 请教 请教各位,是不是镀镍的表面可焊性就会稍差一些,而且焊锡流动和湿润不好? Best regards! Tommy Wang 王鑫 MAS Product Engineer Laird Technologies(Beijing)Co,Ltd. No.14,Jin Xiu Street,Bussiness Development Area,Beijing 100176,China 英资莱尔德无线通信技术(北京)有限公司 中国北京市经济开发区锦绣街14号(100176) Phone:+86 10 5933 3471 Mobile:+86 15011516577 E-mail:[log in to unmask] Website:www.lairdtech.com ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please visit http://www.messagelabs.com/email ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________