Torsten, how did this turn out? -----Original Message----- From: Stadem, Richard D. Sent: Wednesday, November 24, 2010 9:11 AM To: [log in to unmask]; 'Torsten Hagge' Subject: RE: [TN] modelling material/dough for wave soldering Hi, Torsten What you are probably looking for is Chavant Y2-Klay, or CM-70 or J-88. http://www.chavant.com/new_site/index.htm Y2-Klay is a good choice, it cures very hard is lightweight, and is easy to machine or tool after it is cured. It is an industrial modeling clay, and I have used it many times for design work. It is also a low-sulphur clay. You do NOT want a high sulphur content, as it can cause certain finishes to react, especially immersion silver, ENIG, and immersion tin. Please let me know what you chose, and how it works. Thanks Dean Stadem -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Torsten Hagge Sent: Wednesday, November 24, 2010 7:42 AM To: [log in to unmask] Subject: [TN] modelling material/dough for wave soldering Hi technetters, has somebody knowledge about a modelling material/dough which can be used to build up fixtures for wave soldering process? We have heard that it gives a material which can be placed over the components and which is hardened by the first solder process to be used for many cycles, any idea about type/vendor? Thanks and best regards, Torsten i.A. Dipl.Ing.(FH)Torsten Hagge tech. projectmanager Kristronics GmbH Gewerbegrund 5 - 9 24955 Harrislee Tel.: +49 461 7741 624 Fax: +49 461 7741 642 [log in to unmask] www.kristronics.de Gerichtsstand Flensburg, Handelsregister: HRB 1433 FL Geschäftsführer Dipl.-Ing. oec. Thormod Ohm Ust-Id-Nr. DE 811182059 Bankverbindung: Deutsche Bank AG Flensburg, Konto-Nr. 4216610, BLZ 21570011 IBAN: DE32 2157 0011 0421 6610 00, BIC: DEUT DE HH 215 ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------