Hi Leland, I have not seen any data on vibration specifically. The most common reason for using corner bond is to increase reliability for drop testing. I have seen occasions where drop tests went from less than a 50% passing rate to 100% with the corner bond in place. The secondary benefit is higher reliability after thermal shock. We do not have any data cleared for sharing publically regarding light-curable adhesives just yet. The Henkel guys published a good paper demonstrating quantitative benefits of corner bond and re-reflow application epoxy materials, "Processing and reliability of corner bonded CSPs." It is available online through ieee.org. Jon Galaska Dymax -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Friday, December 03, 2010 1:56 PM To: [log in to unmask] Subject: Re: [TN] Component corner bonding Will corner bonding a BGA prevent the issue I discussed yesterday? If so, have any studies been conducted to conclude it will provide X% better reliability? Leland -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jonathan Galaska Sent: Friday, December 03, 2010 11:53 AM To: [log in to unmask] Subject: Re: [TN] Component corner bonding Hi Genny, There are various different adhesive technologies available for corner bonding. One of the newer technologies is light-curable adhesives. They are applied to the board post-reflow and cured in seconds. Flow is engineered to wet the edge of the component while minimizing flow underneath. This is important for BGAs where the outside edge of balls can be very close to the edge of the BGA. It's also needed ensure all material gets exposed to light and cures. If fast process speed is critical for the application, this technology may be worth a look. More information is available here: http://www.dymax.com/pdf/literature/lit244_leadless_component_ruggedizat ion_sell_sheet.pdf The most common one we have is 9422-SC. It's readily available, we can ship a few sample syringes immediately if desired. Jon Galaska Dymax ***************** CONFIDENTIALITY STATEMENT ********************** The information contained in this message and any attachment(s) may be privileged, confidential, proprietary or otherwise protected from disclosure and is intended solely for the use of the individual or entity to whom it is addressed. If you are not the intended recipient, you are hereby notified that any dissemination, distribution, copying or use of this message and any attachment is strictly prohibited and may be unlawful. If you have received this message in error, please notify us immediately by replying to this email and permanently delete the message from your computer. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Bremer Sent: Friday, December 03, 2010 10:55 AM To: [log in to unmask] Subject: Re: [TN] Component corner bonding We use 3M(tm) Scotch-Weld(tm) Epoxy Adhesive EC-2216 A/B Gary Bremer Hardware Quality "And can the liberties of a nation be thought secure when we have removed their only firm basis, a conviction in the minds of the people that these liberties are the gift of God? That they are not to be violated but with his wrath? Indeed I tremble for my country when I reflect that God is just: that his justice cannot sleep for ever." --Thomas Jefferson, Notes on the State of Virginia, Query 18, 1781 > Date: Fri, 3 Dec 2010 09:41:25 -0600 > From: [log in to unmask] > Subject: [TN] Component corner bonding > To: [log in to unmask] > > Can anyone suggest any materials they use for corner bonding a BGA? > Looking for specific manufacturer brand/part numbers, preferably > something that is available immediately if not sooner. > We seem to have misplaced our stock we thought we had, and need some > desperately and it has a 7 week lead time... > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------