At one time with conducted a flat section on the BGA to expose the chip bumps for continuity testing of the isolated net. After that the flat section continues onto the device carrier and repeat testing with curve tracer. "X" -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards Sent: Friday, December 03, 2010 12:59 PM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Leland, I assume that when you mean Y-direction you are saying the displacement is in the z-axis of the BGA... Paul Paul Edwards Surface Art Engineering -----Original Message----- From: Leland Woodall [mailto:[log in to unmask]] Sent: Thursday, December 02, 2010 1:45 PM To: TechNet E-Mail Forum; Paul Edwards Subject: RE: [TN] BGA Failure Analysis Recommendations Paul, The unit that failed was being tested in the Y-direction at a sweep from 20 to 200 Hertz. Leland -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards Sent: Thursday, December 02, 2010 3:16 PM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Which direction was the vibration induced and at what frequency? Paul Paul Edwards Surface Art Engineering -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Thursday, December 02, 2010 11:54 AM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Werner, Actually the assembly failed a multi-cycle vibration test. The test details were developed by a team of the customer's design and our R&D group. The test itself is supposed to reflect a worst-case scenario of 10 years of product usage. Leland -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier Sent: Thursday, December 02, 2010 2:13 PM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Hi Leland, Most HALT tests are NOT accelerated reliability tests-the first tests for robustness and for the second you should follow IPC-9701. Werner -----Original Message----- From: Leland Woodall <[log in to unmask]> To: [log in to unmask] Sent: Thu, Dec 2, 2010 11:01 am Subject: Re: [TN] BGA Failure Analysis Recommendations Richard, We've priced but not yet purchased a BGA inspection scope. I'll check the one you've mentioned below from Practical. It might be thousands cheaper than what we're considering, and yet perform the same function. As far as the component, it was not reworked. The unit passed all our in-house testing before being submitted to our HALT process. The board finish is OSP. Leland -----Original Message----- From: Stadem, Richard D. [mailto:[log in to unmask]] Sent: Thursday, December 02, 2010 10:57 AM To: TechNet E-Mail Forum; Leland Woodall Subject: RE: BGA Failure Analysis Recommendations Or you have an internal via barrel crack. One way to tell is to purchase the small inspection prisms from Practical Components. No BGA assembler/inspector should be without one. You can use any standard microscope and the inspection mirror to see under almost any BGA. The prism has a beveled edge so you can get right down to the PWB, and you can angle the mirror to obtain the best view. The prism is mounted on the end of a small wire that goes into a handle much like an exacto knife handle. Imagine a 9-iron with a highly polished face, but in miniature. To use it, you only need about .070" clearance around the BGA periphery. Back to the cause of the intermittent open. If the BGA was previously reworked, and this did not fix the issue, then it is probably an internal via separation. These are quite often mistaken for a bad BGA solder connection. If it is a solder joint issue, it is usually either BP or BF. What is the circuit board finish? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Thursday, December 02, 2010 9:36 AM To: [log in to unmask] Subject: [TN] BGA Failure Analysis Recommendations Good morning, everyone! I'm looking for some advice on how to best analyze a BGA problem. We had an assembly to fail in a reliability test, and have isolated the problem to an intermittent contact on the BGA device. When downward pressure is applied to the component it will pass. Without the pressure, it won't. That tells me we have either fractured a joint, had a ball to separate from the package, or had a head in pillow (or non-wet) condition. We don't have a BGA inspection scope in house, and I can only see two of the four outside edges with the equipment I have. Of course, nothing is wrong with those. We have both 2 and 3D xray machines, but neither detect a flawed condition. At this point, do I go with dye and pry, or conduct a series of cross sections? What's the recommendations of the pros out there that have dealt with this? Your suggestions are sincerely appreciated! Leland Woodall ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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