Ha! Stewart, I have had a running friendly battle with Rick Short of Indium over that. He insists on Head In Pillow (HIP), while I champion Head On Pillow, as I said HIP doesn't fit (pun intended), unless you are a member of the KKK - and I sent him a picture of some white clad fellows burning a cross to make my point. Bev ----- Original Message ----- From: Stewart McCracken [mailto:[log in to unmask]] Sent: Thursday, December 02, 2010 04:32 PM To: [log in to unmask] <[log in to unmask]> Subject: Re: [TN] BGA Failure Analysis Recommendations Hi Vladimir, You got that right. Best plan is to assess on basis of x-ray and electrical test results, understand what you're trying to achieve and make a choice as to which f.a. technique is going to give you most productive feedback. Just like x-ray, no single technique is perfect for getting all the info that we would like, and typically we can't "have our cake and eat it". If no evidence of HIP/HOP (could this be a cool new fail mode?), and x-ray doesn't point to an alternative, micro-section is the way to go. If we keep getting into the semantics, I might go for head-under-pillow soon! ;-) Kind regards, Stewart Stewart McCracken MCS Ltd. Centre House Midlothian Innovation Centre Roslin Midlothian EH25 9RE m. +44(0)7711 541735 t. +44(0)131 440 9090 f. +44(0)131 440 9085 e. [log in to unmask] w. www.themcsgroup.co.uk -----Original Message----- From: vladimir Igoshev [mailto:[log in to unmask]] Sent: 02 December 2010 21:12 To: TechNet E-Mail Forum; Stewart McCracken Subject: Re: [TN] BGA Failure Analysis Recommendations Stewart, I don't think that sectioning is always the way to go, particularly if there is a case of Hop. If X-ray shows it, then I'd usually pull-off the BGA and do SEM/EDS on the head and pillow. It gives much more information than just sectioning. Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca -----Original Message----- From: Stewart McCracken <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Thu, 2 Dec 2010 20:03:05 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Stewart McCracken <[log in to unmask]> Subject: Re: [TN] BGA Failure Analysis Recommendations Which is another good reason to micro-section. Seriously though, if you are looking for root-cause, the last thing you want is uncertainty. X-ray is great as a supporting tool, but IMHO, often not the tool to allow conclusive root-cause to be identified. No matter how well resolved (or not), x-ray will never give you the materials (and indirectly) processing information which micro-section analysis does. One of the best points in favour of micro-section is the definitive nature of the output. If there is a failure to form (HIP or similar) or failure of a joint which initially formed (fracture through IMC or solder), and assuming that the micro-section is prepared and inspected correctly, you WILL find it with micro-section. Kind regards, Stewart Stewart McCracken MCS Ltd. Centre House Midlothian Innovation Centre Roslin Midlothian EH25 9RE m. +44(0)7711 541735 t. +44(0)131 440 9090 f. +44(0)131 440 9085 e. [log in to unmask] w. www.themcsgroup.co.uk -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE) Sent: 02 December 2010 19:50 To: [log in to unmask] Subject: [TN] FW: [TN] BGA Failure Analysis Recommendations Actually, it just needs to be open to interpretation. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev Sent: Thursday, December 02, 2010 12:40 PM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations And the crack has to be rather wide-open Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca -----Original Message----- From: Werner Engelmaier <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Thu, 2 Dec 2010 14:20:31 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]> Subject: Re: [TN] BGA Failure Analysis Recommendations Yes, Bob, you are. SJ cracks/fractures, brittle or otherwise, cannot be seen with the typical X-ray machine. However, there are X-ray machines out there that can look at individual SJs and can see fracture-this is rather time-consuming, though. Werner -----Original Message----- From: Robert Kondner <[log in to unmask]> To: [log in to unmask] Sent: Thu, Dec 2, 2010 11:54 am Subject: Re: [TN] BGA Failure Analysis Recommendations Hi, I am very interested in how this turns out. Here we have a known problem at a known location and neither 2D or 3D X-Ray show the error. Did I get that right? This makes me question X-Ray inspection as a general inspection method. If you have a blob of solder under a part sure. But opens seem to be an issue? Am I overly critical of X- Ray here? Thanks, Bob K. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Thursday, December 02, 2010 10:36 AM To: [log in to unmask] Subject: [TN] BGA Failure Analysis Recommendations Good morning, everyone! I'm looking for some advice on how to best analyze a BGA problem. We had an assembly to fail in a reliability test, and have isolated the problem to an intermittent contact on the BGA device. When downward pressure is applied to the component it will pass. Without the pressure, it won't. That tells me we have either fractured a joint, had a ball to separate from the package, or had a head in pillow (or non-wet) condition. We don't have a BGA inspection scope in house, and I can only see two of the four outside edges with the equipment I have. Of course, nothing is wrong with those. We have both 2 and 3D xray machines, but neither detect a flawed condition. At this point, do I go with dye and pry, or conduct a series of cross sections? What's the recommendations of the pros out there that have dealt with this? Your suggestions are sincerely appreciated! Leland Woodall ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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