Head in pillow should be discernable by both 2 and 3d X-ray. Cracks at the interface are not usually detected by x-ray. Some hint may be given if there are microvoids at the interface circuit pad/solder ball ( may be present with immersion Ag or OSP)? Interface Ball/component pad is on ENIG circuit and if you remove the BGA and the location is there you can see the pads of the BGA without solder or some visual indication for black pad on the component. Pad separation from conductor/pad cratering can be seen sometimes visually or by X-ray if you decide to remove the BGA from the assembly. Bond damage by popcorning can not be seen by X-ray, but by decapsulation of the component you can see it . If the BGA has no internal bonds -you surely can check if there are bonds or balls inside-the the problem is difficult, but still you can cross section the component with the die . Gaby -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: ה 02 דצמבר 2010 20:24 To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Jerry, They successfully demonstrated detection of opens, ball separations, and head in pillow conditions when we qualified our machine prior to the purchase. That's why we're all scratching our heads over this particular failure... Leland -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jerry Dengler Sent: Thursday, December 02, 2010 1:18 PM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Hi Leland, Maybe you can talk to the X-ray manufacturer to see if they can come in and show you how wonderful their machine really is by finding this fault. Jerry -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Thursday, December 02, 2010 1:04 PM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Maybe our 3D X-ray needs a little tweaking in some form or fashion. We've yet to utilize it a lot for failure analysis (because, thank heavens, this is the first we've had). Leland -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev Sent: Thursday, December 02, 2010 12:48 PM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations And that was exactly why I said that good (high resolution) X-ray inspection should be done first :-) Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca -----Original Message----- From: "Wenger, George M." <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Thu, 2 Dec 2010 11:41:01 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Wenger, George M." <[log in to unmask]> Subject: Re: [TN] BGA Failure Analysis Recommendations Leland, I don't usually make guesses but if I had to guess I think you might have a case of Head-in-Pillow. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. Sent: Thursday, December 02, 2010 12:00 PM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Vladdimir you are correct but it is not as likely as ENIG Regards, George George M. Wenger Senior Principal Reliability / FMA Engineer Andrew Corporation - Wireless Network Solutions 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 Office (732) 309-8964 Mobile E-mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev Sent: Thursday, December 02, 2010 11:25 AM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations I thought I would mention that Brittle Fracture is not limited only to ENIG with lead-free solders :-) Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca -----Original Message----- From: "Wenger, George M." <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Thu, 2 Dec 2010 10:10:25 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Wenger, George M." <[log in to unmask]> Subject: Re: [TN] BGA Failure Analysis Recommendations Leland, Since the PCB is OSP and not ENIG I would suspect a solderability/soldering defect before a brittle interface fracture. If you decide to do DPA cross sectioning then I would suggest cutting the BGA out from the board close to the BGA perimeter and then looking at each side of the BGA with a convention microscope before cutting the BGA up for cross sectioning. Sometime you can see a couple of rows into the BGA. Regards, George George M. Wenger Senior Principal Reliability / FMA Engineer Andrew Corporation - Wireless Network Solutions 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 Office (732) 309-8964 Mobile E-mail: [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Thursday, December 02, 2010 11:02 AM To: [log in to unmask] Subject: Re: [TN] BGA Failure Analysis Recommendations Richard, We've priced but not yet purchased a BGA inspection scope. I'll check the one you've mentioned below from Practical. It might be thousands cheaper than what we're considering, and yet perform the same function. As far as the component, it was not reworked. The unit passed all our in-house testing before being submitted to our HALT process. The board finish is OSP. Leland -----Original Message----- From: Stadem, Richard D. [mailto:[log in to unmask]] Sent: Thursday, December 02, 2010 10:57 AM To: TechNet E-Mail Forum; Leland Woodall Subject: RE: BGA Failure Analysis Recommendations Or you have an internal via barrel crack. One way to tell is to purchase the small inspection prisms from Practical Components. No BGA assembler/inspector should be without one. You can use any standard microscope and the inspection mirror to see under almost any BGA. The prism has a beveled edge so you can get right down to the PWB, and you can angle the mirror to obtain the best view. The prism is mounted on the end of a small wire that goes into a handle much like an exacto knife handle. Imagine a 9-iron with a highly polished face, but in miniature. To use it, you only need about .070" clearance around the BGA periphery. Back to the cause of the intermittent open. If the BGA was previously reworked, and this did not fix the issue, then it is probably an internal via separation. These are quite often mistaken for a bad BGA solder connection. If it is a solder joint issue, it is usually either BP or BF. What is the circuit board finish? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Thursday, December 02, 2010 9:36 AM To: [log in to unmask] Subject: [TN] BGA Failure Analysis Recommendations Good morning, everyone! I'm looking for some advice on how to best analyze a BGA problem. We had an assembly to fail in a reliability test, and have isolated the problem to an intermittent contact on the BGA device. When downward pressure is applied to the component it will pass. Without the pressure, it won't. That tells me we have either fractured a joint, had a ball to separate from the package, or had a head in pillow (or non-wet) condition. We don't have a BGA inspection scope in house, and I can only see two of the four outside edges with the equipment I have. Of course, nothing is wrong with those. We have both 2 and 3D xray machines, but neither detect a flawed condition. At this point, do I go with dye and pry, or conduct a series of cross sections? What's the recommendations of the pros out there that have dealt with this? Your suggestions are sincerely appreciated! Leland Woodall ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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