Hi, I am very interested in how this turns out. Here we have a known problem at a known location and neither 2D or 3D X-Ray show the error. Did I get that right? This makes me question X-Ray inspection as a general inspection method. If you have a blob of solder under a part sure. But opens seem to be an issue? Am I overly critical of X- Ray here? Thanks, Bob K. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall Sent: Thursday, December 02, 2010 10:36 AM To: [log in to unmask] Subject: [TN] BGA Failure Analysis Recommendations Good morning, everyone! I'm looking for some advice on how to best analyze a BGA problem. We had an assembly to fail in a reliability test, and have isolated the problem to an intermittent contact on the BGA device. When downward pressure is applied to the component it will pass. Without the pressure, it won't. That tells me we have either fractured a joint, had a ball to separate from the package, or had a head in pillow (or non-wet) condition. We don't have a BGA inspection scope in house, and I can only see two of the four outside edges with the equipment I have. Of course, nothing is wrong with those. We have both 2 and 3D xray machines, but neither detect a flawed condition. At this point, do I go with dye and pry, or conduct a series of cross sections? What's the recommendations of the pros out there that have dealt with this? Your suggestions are sincerely appreciated! Leland Woodall ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------