Thanks Dave for your advise. Cheers!
From: David Bergman <[log in to unmask]>
Subject: Re: [TGAsia] IPC standards enquiry on solder pads lifting specs
To: [log in to unmask]
Date: Monday, 15 November, 2010, 11:35 PM
There really isn’t a spec for the attribute of lifted lands after multiple solder stress. IPC-6012C (Rigid PCB spec)indicates there shall be no lift prior to stress, but that land lift is allowed after stress. IPC-4101C (CCL spec) addresses adhesion in a different way by peel strength of the copper foil. There is probably correlation between peel strength and lift after multiple rework cycles, but this isn’t specified in any IPC documents that I am aware of.
Best regards,
Dave
David W. Bergman 大山人
Vice President, International Relations
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive Suite 309S Bannockburn, IL 60015-1249 USA
+1 847-597-2840 tel
+1 847-615-5640 fax
+1 847-867-1388 mobile
[log in to unmask]
Skype: davidbergmanipc
www.ipc.org
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Patricia Lui
Sent: Monday, November 15, 2010 7:08 AM
To: Listserv TGAsia
Subject: [TGAsia] IPC standards enquiry on solder pads lifting specs
I would like to know are there any IPC standards which spelled the minimum requirements of a solder pad able to withstand numerous of soldering and de-soldering reworks before pad lifting? I have tested on some different material brand boards with same pad size and same finishing under the same soldering and de-soldering conditions, some brands material boards can withstand up to 18 cycles but some only 16 cycles. Is there a minimum requirements indicated in any of the IPC standards which I can refer to?
Hope to have your favourable advise.
|
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________