Ed, While the apparent hole fill might be 50%, and it is hard to judge the attributes of the solder connection in the photos, I think I see other defects. In the first image after the x-ray, I don't think there is evidence of wetting to the lead. And the contact angle of the solder at both the lead and the PTH appears to be much greater than 90 degrees. The second image is harder to evaluate but seems to have the same defects. The third image, in my judgment, exhibits poor wetting between the lead and the PTH for more than 90 degrees. Some of the solder joint looks normal. The fourth image is really blurry but I would argue that it is close to insufficient vertical fill. Guy -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski Sent: Thursday, November 11, 2010 11:26 AM To: [log in to unmask] Subject: Re: [TN] Pin in paste hole fill Good Morning, I've added a few photos at http://ipc-technet.groupsite.com/galleries/photo/158694 of the resultant non-wetting that is of concern should this exist on the hole wall. Any comments? Regards, Ed Popielarski Sr. Mfg. Engr. NBS Corporation 2950 Patrick Henry Dr. Santa Clara, Ca. 95054 Ph: 408-654-1100 Fx: 408-654-1107 Cl: 408-234-1497 Cl: 949-581-6601 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski Sent: Wednesday, November 10, 2010 12:56 PM To: [log in to unmask] Subject: [TN] Pin in paste hole fill Greetings 'netlings, I present here http://ipc-technet.groupsite.com/galleries/photo/158694 an x-ray image of a pin-in-paste thru-hole connection, SAC305 with NC on a .092" OSP SMT both sides assy with some very bothersome ground planes. My concern is we are trying to achieve 50% hole fill and 610 makes an assumption the hole is full from one side or the other. Our 5DX is happy with this assumption as well. What we have here is >50% hole fill by volume, however there is void in the middle of the joint caused by gassing of the flux. 5DX doesn't like to so well. We have had mixed results with wave and selective as the "techs" tend to compensate hole-fill difficulties (primary root cause: oxidation) by overexposure and causing Cu dissolution, sometimes to total annular ring disappearance. My question is twofold: Is 610 "interpretable" to accept >50% on Class 2 ground pins if the hole fill is not continuous, i.e., 26% from top down and 26% from bottom up, 48% void in the center?: I've noticed some holes have a "sausage" shape indicating the possibility of non-wetted hole wall and we're simply "molding" the solder into shape and not making an integral connection. If this is possibly the case, is there any non-destructive test we can do to verify integrity? Now off subject: History of Electricity was awesome! I think there should be a subchapter in the section on smoke theory to cover the electrolytic confetti generator and the noise emitting diode. Regards, Ed Popielarski Sr. Mfg. Engr. NBS Corporation 2950 Patrick Henry Dr. Santa Clara, Ca. 95054 Ph: 408-654-1100 Fx: 408-654-1107 Cl: 408-234-1497 Cl: 949-581-6601 ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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