Never mind. I just read the original post. I'm betting the whole shebang is due to poor wetting--that's why the correlation to the fanout escape. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW Sent: Monday, October 11, 2010 2:52 PM To: [log in to unmask] Subject: Re: [TN] Mech. damage or poor wetting? What's going on with the picture of the cross section? The ball isn't wetting down the side of the plated pad. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna Sent: Monday, October 11, 2010 2:41 PM To: [log in to unmask] Subject: Re: [TN] Mech. damage or poor wetting? Here are a few pictures http://ipc-technet.groupsite.com/gallery/16011 this job is a mixed bag. Currently we suspect soldering, cratering, ICT and t-cycling damage Chris From: [log in to unmask] [mailto:[log in to unmask]] Sent: Monday, October 11, 2010 2:22 PM To: TechNet E-Mail Forum; Chris Mahanna Cc: [log in to unmask] Subject: Re: [TN] Mech. damage or poor wetting? Hi Chris - do you have any pictures you can share? Dave Hillman Rockwell Collins [log in to unmask] Chris Mahanna <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 10/11/2010 11:29 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Chris Mahanna <[log in to unmask]> To [log in to unmask] cc Subject [TN] Mech. damage or poor wetting? We have a BGA dye-n-pry job that shows board side sj damage with a strong correlation to fan-out clocking. We also have some microsection evidence of poor wetting. All damage/dye is on perimeters. Is this an indication of heat sinking and subpar wetting, or can it be completely mechanical? Both? Thanks Chris ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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