Hallo Günter, Wie geht's? The separation is classical 'ENIG 'Black Pad'—separation between Ni and IMC layers with dark area being high P concentration; the micro-voids are not [these voids do not look like Kirkendall voids]. I do not know what you mean be "cracks are somewhere in the width of the solder joint"--I do not see any cracks in the solder, just those voids. Werner -----Original Message----- From: Grossmann, Guenter <[log in to unmask]> To: [log in to unmask] Sent: Wed, Oct 27, 2010 3:36 am Subject: [TN] Cracks in BGA solderjoints Hi Technetters I have an effect in BGA solder joints that I have never seen before. In microsections and in FIB preparations I see cracks between the IMC and a slightly darker region towards the Ni which I assume to be a P enriched zone of the Ni. However, the cracks are somewhere in the width of the solder joint and they are quite short running out to a row of pores that look somehow like Kirkendall voids. Is there still a possibility to place one or two pictures? Kim's IPC site doesn't work. Best regards Günter ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------