Hello Technet
I've been asked to look at an interesting R&O project.  We have a flex
soldered to SMT pads on a ceramic wafer, we need to replace some wafers.
My first thoughts are to use a hot air tool to reflow the solder and
remove the flex from the old wafer, and then maybe screen some paste on
the new wafer, align the flex and again use the hot air to reflow it.

Any opinions on this, am I out to lunch or on the right track?

Thanks!

Graham Collins 
L-3 Communications ES


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------