How many layers on that flex?. Need to be a little careful with that because of the adhesives on a multi layer are not as robust as a circuit board assembly. Also the ceramix will soak heat due to the TTC so suggest pre heating on a hot plate. John -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins Sent: Tuesday, October 19, 2010 7:17 AM To: [log in to unmask] Subject: [TN] Soldering a flex to a ceramic wafer Hello Technet I've been asked to look at an interesting R&O project. We have a flex soldered to SMT pads on a ceramic wafer, we need to replace some wafers. My first thoughts are to use a hot air tool to reflow the solder and remove the flex from the old wafer, and then maybe screen some paste on the new wafer, align the flex and again use the hot air to reflow it. Any opinions on this, am I out to lunch or on the right track? Thanks! Graham Collins L-3 Communications ES ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------