建议：
--焊接时间尽量短些；
--换种锡线试试。
David Lau | Asst. Manager,Telecom PIE | Embedded Power | Fuyong
Emerson Network Power | Emerson Industrial Park,Feng Tang
Road,Fuyong,Bao,an District | ShenZhen 518103 China
T +86.755.29616219 | F +86.755.29616499
www.Emerson.com/EmbeddedPower
Connect with Embedded Computing & Power on Facebook, Twitter and YouTube.
YIN Zhaohong <[log in to unmask]>
09/27/2010 04:48 PM
Please respond to
Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
YIN Zhaohong <[log in to unmask]>
To
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Subject
[TGAsia] 请教：手工焊接问题
大家好
电路板在手工焊接完插件后，焊点周围很脏，不知如何避免这个现象。我们使用的是
免清洗焊锡丝。
尹朝洪
-----邮件原件-----
发件人: TGAsia [mailto:[log in to unmask]] 代表 Paul Zong
发送时间: 2010年9月15日 10:37
收件人: [log in to unmask]
主题: Re: [TGAsia] 请教 PCB包装问题！
Dear Alphy:
您好，1601这本标准是IPC的收费标准需要购买，而伟创力集团作为IPC的会员公
司是可以对该标准进行免费下载的。您可以通过这个途径去获得1601标准的完成版，
谢谢。
Best Regards
Paul Zong 宗云龙
-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Alphy Lin
Sent: 2010年9月15日 8:42
To: Listserv TGAsia
Subject: Re: [TGAsia] 请教 PCB包装问题！
Dear All,
请问谁有最新的1601标准，请帮忙共享一下4.2.3和4.2.4的内容，是否必须有干燥剂
和湿度指示卡。我们目前与PCB制造商在PCB包装方法上存在一些争议。
Thanks
Flextronics Electronics Technology (Shenzhen) Co., Ltd.
TEL : +86 755 2731 4188 (ext 8986)
Mobile : +86 18923779532
FAX : +86 755 2731 4189
E-mail : [log in to unmask]
☆ Creating Value That Increases Our Customer's Competitiveness ☆
-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Paul Zong
Sent: Thursday, September 09, 2010 10:04 AM
To: [log in to unmask]
Subject: Re: [TGAsia] 请教 PCB包装问题！
Hi Mainer:
在IPC最新出版的1601标准中有你所需要的内容。作为会员公司你可以发送邮件至
[log in to unmask]<mailto:发送给[log in to unmask]>，进行该
标准免费电子版的申请. http://www.ipc.org/TOC/IPC-1601.pdf 是该标准的目录。
以下是1601的内容介绍供你参考。
IPC-1601<
https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=806377ad-9cb6-df11-a831-002219545fd5
> Printed Board Handling and Storage Guidelines The industry's sole
guideline on the handling, packaging and storage of printed boards. The
guidelines in this document are intended to protect printed boards from
contamination, physical damage, solderability degradation and moisture
uptake. Consideration is given to packaging material types and methods,
production environment, handling and transport of product, establishing
recommended moisture levels, establishing baking profiles for moisture
removal and the impact of baking on printed board solderability. 18 pages.
Best Regards
Paul Zong 宗云龙
[cid:[log in to unmask]]
IPC China
上海市谈家渡路28号盛泉大厦16AB
Suite 16AB，Shengquan Building，#28 Tan Jiadu Rd., Putuo District,
Shanghai 200063 PRC
Tel: +86 21 54973435*605
Fax: +86 21 54973437
MP: +86 139 1855 2463
[log in to unmask]<mailto:[log in to unmask]>
www.ipc.org<http://www.ipc.org/>
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Mainer Zhou
Sent: 2010年9月9日 9:31
To: Listserv TGAsia
Subject: [TGAsia] 请教 PCB包装问题！
Hi all,
请问各位，有谁手上有PCB 的包装的要求，如，在包装PCB时，是否需要有无油纸
，或是否一定要有干燥剂等。
另外，PCB 若既没有无油纸，又没有放置干燥剂时，一般的储存条件和时间是多
久。
Best Regards,
Mainer Zhou
Quality Engineer, Ingenico
Flextronics Technology (Shanghai) Co.,Ltd.
Address: No.77 Yong Sheng Rd., Malu Jiading Shanghai China, 201801
CDMA: 15316700220
Mobile: 021-13916096640
Direct: 021-39158131
Main: mainer [log in to unmask]<
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