I guess this is an easy one for most you... If solder paste is applied to a PWB with a 0.10+/-0.01mm thick stencil what is the minimum height of paste I can expect to get on the PWB? Sn95.5Ag3.8Cu0.7 paste , DAP (20 - 38 μm) or Sn95.5Ag4.0Cu0.5, IPC type 3 (25-45 μm) if composition makes much difference. Thanks, -- Eric Christison Consumer& Micro group Imaging Division STMicroelectronics (R&D) Ltd 33 Pinkhill Edinburgh EH12 7BF United Kingdom Tel: +44 (0)131 336 6165 Fax: + 44 (0)131 336 6001 ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------