发件人: John Zhou <[log in to unmask]>
主题: Re: [TGAsia] PCB 分层问题
收件人: [log in to unmask]
日期: 2010年8月23日,周一,上午11:53

各位大虾：

      请教个PCB分层问题, 我们的PCB 在过IR reflow 之后约有0.5%-1%的分层问题，可以排除潮湿问题（PTH前有烤155度，4小时，24小时内完成PTH), PCB工艺完成之后马上到EMS工厂组装,看切片也不象压合的问题，因为都是PP片内部分层而不是层与层之间分开.

      目前我们怀疑PP有问题， 但是RC.RF, Gel time 和 VC 值都在规格内, 正在准备测试260分层时间和热裂解温度和PP的桥接剂dicy的再结晶，诸位大虾知道哪里可以检查PP材料里面的桥接剂dicy再结晶？PP还有什么需要测试的吗？

      

John Zhou/Supplier Quality Engineer
Pace China
MP#: (0086) 138 2528 2354
深圳宝安机场进场大道机场信息大楼六层东区646-648室
Rm 646-648 F/6, East, ShenZhen Airport Information building, Airport Entrance road, BaoAn District, ShenZhen, 518218

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