Guy, is conveyor speed that needs to be look at to see if the flux is being properly activated and not too early or too late? And how would you actually know that? Any tests that can be done? Doing an analysis of the flux residue on a test board? You peak my curiosity, Thanks, Jon -----Original Message----- From: Guy Ramsey [mailto:[log in to unmask]] Sent: Wednesday, August 25, 2010 9:33 AM To: 'TechNet E-Mail Forum'; Roberts, Jon (SA-1) Subject: RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS I didn't reply because I had never seen that finish. But, Pd yes, and yes I agree with Dave with one proviso. Make sure you are not driving all the flux off too early. Then you get joints that look like the profile is too cool when in fact it is too slow, increasing temp only makes it worse. Guy -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1) Sent: Wednesday, August 25, 2010 10:20 AM To: [log in to unmask] Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS Dave Hillman assumed correctly. I had in the subject matter, just goof trying to type the Pd. Middle finger was too slow and let my index finger take over. Are you in agreement with Dave Hillman response? Little more information related to the issue: This affects several SMT OPA part numbers with the same finish. Have some in stockroom for over 3 years, so cannot send back to vendor. Have to use an RMA No Clean type flux (ROL0) (We clean). I have provided recommendation to those working the corrective action that was issued to manufacturing. Those included: 1. Sending a sample to have the analyses both for any contamination and solderability. We could perform the second one here but I recommended an outside lab due it. 2. Measure the lead temperature during a reflow cycle. 3. Measure the lead temperature during the hand solder process that uses a soldering iron and liquid RMA No Clean flux (ROL0). 4. Send the necessary quantity from stock prior to the next build to have pre-tinned and at that time the source we use can use a stronger flux, if necessary and are able to clean properly prior to putting back on tape and reel. Also we have had this issue several times before and the solution was to rework/replace the parts but it was in smaller lot sizes. Now it is larger lot sizes being processed and affected. Again I thank those on IPC TechNet and their expertise. Jon -----Original Message----- From: Stadem, Richard D. [mailto:[log in to unmask]] Sent: Tuesday, August 24, 2010 4:55 PM To: TechNet E-Mail Forum; [log in to unmask]; Roberts, Jon (SA-1) Subject: RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS Well, jeez, Dave. You beat me to it again. Except I was busy trying to find my references to soldering with platinum, not palladium. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman Sent: Tuesday, August 24, 2010 4:13 PM To: [log in to unmask] Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS Hi Jon! There are a couple things to remember when dealing with NiPdAu surface finishes: 1) Pd diffuses very slowly into a tin/lead solder alloy. You may need to add a few seconds to your soldering process cycle time; 2) Adding an additional 5-10C of temperature will assist in the Pd diffusion into the tin/lead solder alloy. You may need to increase your soldering temperature depending on which soldering process you are using; 3) Some flux material are not compatible with Pd materials. You may want to try a different flux to see if you get an improved reaction; 4) Run a solderability test per IPC JSTD 002 to make sure you have an acceptable NiPdAu surface finish. When Texas Instruments first introduced the NiPdAu surface finish, we had to make slight time/temperature/flux adjustments on our typical soldering processes to obtain our expected soldering results. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] "Roberts, Jon (SA-1)" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 08/24/2010 12:41 PM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Roberts, Jon (SA-1)" <[log in to unmask]> To [log in to unmask] cc Subject [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS Have any of you experience difficulty in producing an acceptable solder joint with Nickel platinum gold SMT lead finishes? We can rework at least twice to achieve an acceptable condition. Lead free part but we use a solder with lead. Any help is appreciated. Jon This communication is intended only for use by the addressee(s) named herein and may contain business confidential and/or legally privileged information. 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