Ioan,

I see this quite often on our fine pitch components.  We haven't experienced any problems to date due to this condition.

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Wednesday, August 18, 2010 10:28 AM
To: [log in to unmask]
Subject: [TN] Bulging solder on the sides of QFP leads

Dear Technos,

 

Please see the gallery http://ipc-technet.groupsite.com/gallery/14996

 

There seems to be an excess of solder, hence the bulging aspect of the joints along the pins. Can there be any issue with this? IPC-A-610 does not seem to be concerned with this situation, as long as the minimal electrical clearance is not violated, and it's not.

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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