20 mil pitch, 10 mil wide and 5 mils longer than pad length apertures, 6 mil stencil Thanks, Ioan Tempea, ing. Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T | 450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W | www.digico.cc <http://www.digico.cc/> N'imprimer que si nécessaire - Print only if you must De : [log in to unmask] [mailto:[log in to unmask]] Envoyé : August-18-10 10:32 AM À : TechNet E-Mail Forum; Ioan Tempea Cc : [log in to unmask] Objet : Re: [TN] Bulging solder on the sides of QFP leads Hi Ioan - what stencil thickness did you use and what stencil aperture scheme did you use? Dave Hillman Rockwell Collins [log in to unmask] Ioan Tempea <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 08/18/2010 09:27 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Ioan Tempea <[log in to unmask]> To [log in to unmask] cc Subject [TN] Bulging solder on the sides of QFP leads Dear Technos, Please see the gallery http://ipc-technet.groupsite.com/gallery/14996 There seems to be an excess of solder, hence the bulging aspect of the joints along the pins. Can there be any issue with this? IPC-A-610 does not seem to be concerned with this situation, as long as the minimal electrical clearance is not violated, and it's not. Thanks, Ioan Tempea, ing. Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T | 450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W | www.digico.cc <http://www.digico.cc/> N'imprimer que si nécessaire - Print only if you must ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------