TechNet: http://stevezeva.homestead.com/marvell_88E1111.pdf Steve has so graciously posted a couple pages of the mfr datasheet showing the pad geometry of a 96-pin BCC device we are using for the first time. I'm pretty sure this has been discussed before & we didn't think we'd be using something like this so wasn't paying too much attention to the thread - and now I'm not able to locate it in the archives. Our question is the layout design on the fab - should the pad size be equal to or greater than the device pads? If greater than, then by how much? Sn/Pb soldering processes are required for assembly. Any ideas or comments would be greatly appreciated. Thanks in advance, Loa --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------