I don't pretend to be an expert at miniaturisation but there are three different criteria which I think have to be taken into account: - probably the most important is the active component. There are limits to the width of features within semiconductors, under which reliability starts to fall vertiginously. This can be partially overcome by stacking chips to get more features into a given volume. - then there is the passive component and it is possible that the limit here is the ability for insertion machinery to handle them with sufficient accuracy of placement, quite apart from the difficulty of actually manufacturing these reduced size components - the third limitation is in the interconnection between the components whether they be active or passive. This is the role of the printed or hybrid circuit and it is possible that we have not reached the limit but, doing so, may increase the costs exponentially. Then you have to consider the assembly of all three of these criteria into something that can be made to work. Over the past 20 years or so our industry has passed through a revolution which has allowed extreme miniaturisation with reduced costs for the final product. In my opinion, it is probable that this state of affairs will come to an end in the very near future. Yes, there will be increased miniaturisation but only for those applications where it is absolutely essential because prices will probably rise rather than descend in order to meet the technological parameters. What I have written here is pure opinion with a little dash of speculation. Take it for what it is worth (and that is maybe nothing!). As a futurologist my track record has been average, with some mistakes and some successes. Brian On 14/08/2010 01:07, Sharon Starr wrote: > Hello TechNetters, > > I am new on TechNet and I'm more of business/economics geek than a techie, so I hope you'll bear with me if I ask some obvious questions. I am developing a study of technology trends in the electronics interconnect industry for IPC. One of the trends we're looking at is miniaturization. With nanotechnology coming into play, I'm wondering where the limits are and what roadblocks might be slowing the trend. > > So here's my question: apart from end-use requirements, what factors currently limit continued miniaturization in circuitry dimensions? Do you see solutions to these limiting factors in the works? Do any of them seem insurmountable? Your ideas, opinions or predictions will be very helpful. > > With thanks, > Sharon > > Sharon Starr > Director of Market Research > IPC - Association Connecting Electronics Industries(r) > 3000 Lakeside Drive > Suite 309 S > Bannockburn, IL 60015-1249 USA > +1 847-597-2817 tel > +1 847-597-2845 fax > [log in to unmask]<mailto:[log in to unmask]> > www.ipc.org<http://www.ipc.org> > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------