Phil Could you share the link to Qualcomm BCC guideline doc. Thanks Best Regards Mickey Weiner 972-8-9774808 On Tue, Aug 10, 2010 at 9:57 PM, Phillip Bavaro <[log in to unmask]>wrote: > Definitely greater. > > BCCs have very specialized pad requirements. You might want to review > Qualcomm's BCC guideline document for this package. > > Phil > > > > > ________________________________ > From: Loa Allen <[log in to unmask]> > To: [log in to unmask] > Sent: Mon, August 2, 2010 7:18:23 AM > Subject: [TN] Bump Chip Carrier (BBC) pad geometry > > TechNet: > > http://stevezeva.homestead.com/marvell_88E1111.pdf > > Steve has so graciously posted a couple pages of the mfr datasheet showing > the pad geometry of a 96-pin BCC device we are using for the first time. > > I'm pretty sure this has been discussed before & we didn't think we'd be > using > something like this so wasn't paying too much attention to the thread - and > now I'm not able to locate it in the archives. > > Our question is the layout design on the fab - should the pad size be equal > to > or greater than the device pads? If greater than, then by how much? > > Sn/Pb soldering processes are required for assembly. > > Any ideas or comments would be greatly appreciated. > > Thanks in advance, > Loa > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16for additional information, or contact Keach Sasamori at > [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > CONFIDENTIALITY This e-mail message and any attachments thereto, is intended only for use by the addressee(s) named herein and may contain legally privileged and/or confidential information. 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