I am debating on what is minimum acceptable solder joint thickness for QFN-32 packages ? Just for clarity , QFN-32 is bottom termination part with no toe joint due to exposed copper on toe. We did cross sectioning and found that solder thickness varies form 15 microns to 45 microns - different footprints. We are wondering what should be minimum acceptable thickness before we need to rework ? Any graph or relationship to determine reliability of joint with respect to thickness of joint ? We are building Class3 products for automotive industry. No information found on thickness of solder joint Except for IPC-7093 (unreleased draft copy) where the solder thickness is mentioned as 50 microns. Anybody to share what should be used as minimum thickness before reworking ? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------