I have some BGAs (not active - just daisy chained with dummy die) in tape & reel that I need to bake. I know I could remove them and put them in trays for baking, but for various reasons I'd like to avoid this. Based on the component thickness, JEDEC recommends 13 days at 40C. My main concern is that heat will effect the glue on the cover tape and make the reel a pain to use on an SMT feeder. I have an oven that has a nitrogen feed and a vacuum pump, so either inerting or vacuum is an option. Has anyone played with using lower temps (30C?) but either inerting or pulling a vacuum? I'm concerned that a vacuum may collapse the cover tape into the pockets and pull the glue loose. I don't necessarily need to reset the moisture clock to 0 either - I just need to reduce the warpage. These are 0.4 mm pitch and I'm getting shorting in the corners. I ran Thermoire on samples before and after a 125C overnight bake and the unbaked samples turned into potato chips above 200C. The corners are warping 200 microns towards the board. The baked samples stay flat during reflow. I'm re-introducing moisture to the baked samples and I'll run Thermoire again to make sure moisture caused the warpage rather than some uncured material that I cured during the 125C bake. Scott Post P.O.U. 0000-001E-0CTC 2151 E. Lincoln Road Kokomo, Indiana 46904-9005 765-451-2983 (Phone) 765-451-0287 (FAX) **************************************************************************************** Note: If the reader of this message is not the intended recipient, or an employee or agent responsible for delivering this message to the intended recipient, you are hereby notified that any dissemination, distribution or copying of this communication is strictly prohibited. If you have received this communication in error, please notify us immediately by replying to the message and deleting it from your computer. Thank you. **************************************************************************************** ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------