Hello, all:
下图为一个TH 元件焊接之后的切片图片（在显微镜锡拍摄）。有两个问题请教大家：

1.       TH 元件插入通孔内，TH 元件的引脚偏向一边，几乎与孔壁接触，所以看不到焊锡的爬升，但是在另一边，焊锡爬升很好。请问这种是润湿良好吗？

2.       在切片图片的左上方，有明显的锡裂，按照焊点破裂来判定，肯定是缺陷；但是按照75% 的垂直填充来做判定的话，貌似焊点破裂没有整个垂直填充的25%.
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I would much appreciate your quick response.

Best regards and thanks
Nancy Deng






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