Jon, Sounds like a SOx problem induced growth shorting the power decoupler... Maybe a little methyl-RTV would help.... Nice to hear you have a definitive F/A result... Paul Paul Edwards Surface Art Engineering -----Original Message----- From: Roberts, Jon (SA-1) [mailto:[log in to unmask]] Sent: Thursday, June 17, 2010 1:26 PM To: TechNet E-Mail Forum; Paul Edwards Subject: RE: [TN] BGA AFTER 2 YEARS IN FIELD FAILED - Found word(s) list error in the Text body Paul, the one picture I saw was what appears to be a very small SMT cap that appeared to be burnt. A lot of green color corrosion around most of those components. I will try to see I can send pictures to Steve Creswick if he is willing to upload. I just found out while typing this email it was cap failure. Thanks, Jon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards Sent: Thursday, June 17, 2010 3:11 PM To: [log in to unmask] Subject: Re: [TN] BGA AFTER 2 YEARS IN FIELD FAILED - Found word(s) list error in the Text body To add to John's comment... While working with chip manufacturers, we have found that sometimes the C4ed chip under the lid has decoupling caps that are soldered to the IC substrate with no-clean flux (as is the IC)...Additionally the metal lidded BGAs typically have a heat sink compound attaching the back of the die to the metal lid. Ideally you need to clean the area under the lid and seal not only to holes but the periphery of the lid... Paul Paul Edwards Surface Art Engineering -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1) Sent: Thursday, June 17, 2010 7:31 AM To: [log in to unmask] Subject: Re: [TN] BGA AFTER 2 YEARS IN FIELD FAILED - Found word(s) list error in the Text body Thanks to all of you who responded to my question and I forward some of those to our reliability engineer and hardware QA investigation the field failure. They found your responses "very informative". Currently we do not cover the holes with anything because the manufacture of the BGA recommend we do not. Should we have? Thanks again, Jon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke Sent: Wednesday, June 16, 2010 5:14 PM To: [log in to unmask] Subject: Re: [TN] BGA AFTER 2 YEARS IN FIELD FAILED Those lids are made with holes in them, this is to stop the lid being forced off during a reflow cycle by the air under the lid expanding and breaking the bond line. The corrosion you are seeing is likely to be due to ingress of water during a water wash after reflow. The boards should be allowed to fully cool to room temp before entering the wash as if they are at a temperature above the wash water the cooling effect of the wash water will cool down the bga and the air under the BGA lid and could lead to water ingress as a result. Best regards, John Burke -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1) Sent: Wednesday, June 16, 2010 12:26 PM To: [log in to unmask] Subject: [TN] BGA AFTER 2 YEARS IN FIELD FAILED Has anyone experience a BGA failure after about 2 years, where under the heat sink of the actual part (metal lid) corrosion has occurred. The lid does pop off, if you applied some pressure to examine, and what we found was corrosion. There appears to be two weep holes on the inside of the part. Unless you have seen it you are probably going to ask me for some more information. I will try and obtain any pictures as long it as it does not show the manufacture. Thanks, Jon This communication is intended only for use by the addressee(s) named herein and may contain business confidential and/or legally privileged information. 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