Hello Technetters, We are changing Packaging suppliers ( shipping containers/trays) for Hi-Rel ceramic packages. I am looking for recommendations for ShipShock test or MIL spec requirements to qualify the new packaging trays/boxes etc. Your inputs will be much appreciated. Thank-you, Mumtaz Mumtaz Bora Senior Packaging Engineer Peregrine Semiconductor 9380 Carroll Park Drive San Diego, CA 92121 858-795-0112-direct 858-731-9499 -fax [log in to unmask] ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------