To JW I don't know if you got any answers from this old E-mail. I looked up the material specs for the SOD-323 and there is no plastic in the body. The high temp body material, phenolic resin with fire retardants and proprietary chemicals, is like the body material of SOIC and SOT parts. As you pointed out the IPC allows solder to touch the body of these glass/phenolic epoxy high temp parts. Solder cannot touch plastic parts since it would melt and functionally or cosmetically damage the part like: plastic connectors, headers, shunts etc. ----- Original Message ----- From: J W To: [log in to unmask] Sent: Tue, 4 May 2010 14:58:26 +0000 (UTC) Subject: [TN] SOD-323 package (body making contact with solder) Hi, Does anyone know if a SOD-323 package falls under the same rules as for SOIC and SOT components, when it comes to solder touching the plastic body? Per IPC 8.3.5.5 it is acceptable (all three classes) for solder to touch a plastic SOIC or SOT component. It is however not acceptable (class 2 and 3) if solder touches the body of a plastic component, except for the SOIC's and SOT's. Thanks! Jim ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------