Hi Carl. I would consider that the arsenic remaining from the plating process is the result of poor cleaning. As a result the arsenic caused oxidation of the Sn of the plating which is a common problem for solderability problems on Sn/Pb which is usually very easy to solder. ----- Original Message ----- From: Carl Ray To: [log in to unmask] Sent: Tue, 8 Jun 2010 18:44:21 +0000 (UTC) Subject: [TN] Arsenic from XRF Testing All, I have a question. We were seeing some solderability issues with some components that were provided by our customer. These devices were Sn-Pb over Cu plating per the data sheet. We tested 3 samples and noticed where all three samples have very high concentration of Arsenic. Some as much 4-5%. What could possibly be the cause for this? I understand Arsenic is used during plating process but I did not think it was as significant as 4-5%. Carl Ray Staff Engineer Teledyne Electronic Manufacturing Services 1425 Higgs Rd. Lewisburg, TN 37091 Direct: 931-270-2724 Cell: 931-637-5958 Email: [log in to unmask] ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------