Reference in 80s may have some discussion about it. If the mask is not cured properly or difficult to cure, you will have solderballs (non wetting characteristic of mask is not developed). -------------------------- Sent using BlackBerry ----- Original Message ----- From: Louis Hart [mailto:[log in to unmask]] Sent: Tuesday, May 04, 2010 04:54 PM To: [log in to unmask] <[log in to unmask]> Subject: Re: [TN] Does solder mask specified create solder balls? Don, A book I have from 1998, Failure Modes and Mechanisms in Electronic Packages, by Viswanadham and Singh, addresses solder balling in a few pages. (At least one of these gentlemen was a Technetter about 10 years ago, I believe.) Among their observations, glossy mask is said, supported by a reference, to promote solder ball formation. Louis Hart -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Don McFarland Sent: Tuesday, May 04, 2010 4:20 PM To: [log in to unmask] Subject: [TN] Does solder mask specified create solder balls? Hi Technetters, I was asked to perform a DOE to determine if there was a correlation between solder mask types and the rate at which we see solder balls develop on the PWB surface. I searched through the archives and found a few articles from the mid-90s about this topic, but couldn't glean anything exciting from the posts reviewed. I am wondering if anyone knows of a good source of information that addresses this topic or has anything that would be useful for us. We have made a number of changes to other process variables (e.g. stencil apertures, solder pastes, paste viscosity, profiles, etc) and have seen good results, but we wanted to rule this out as a causal factor as well. Any help is greatly appreciated! Don McFarland ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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