Werner, I beg to differ... When I did peel tests with TABed parts I found a +30% increase in peel strength when I had side fillets verses not having any... Without side fillets you end up peeling through the lap joint surface interface... With side fillets, your peel forces must propagate through bulk solder and not only just through the lap joint interface.... Paul Paul Edwards Surface Art Engineering -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier Sent: Tuesday, May 04, 2010 5:08 AM To: [log in to unmask] Subject: Re: [TN] Minimum Side Joint Length Hi Mordechai, I would not worry too much about side fillets--the heel fillets are much more important. What should be your real concern about the reliability of your TSOPs SJs is whether your TSOP leadframe is made of Alloy 42 instead of copper. That is where your reliability concern needs to be because of the large CTE-mismatch with FR-4. Werner -----Original Message----- From: Mordechai Kirshenbaum <[log in to unmask]> To: [log in to unmask] Sent: Tue, May 4, 2010 7:43 am Subject: [TN] Minimum Side Joint Length We have to assemble TSOP packages on SSOP foot print PCB. (The TSOP package width is 40 mils shorter than the SSOP package width). We found that the theoretical ( calculated) side joint length (D) will be in some instances less than the minimum acceptable side joint (as by IPC-A-610, #8.2.5.4). (The available pad length on the PCB under the component lead is less than the foot length). It may be even worse if we have a slight solder defect, or if the component is placed several mils off side. What is the reliability impact? Do you know about accelerated reliability tests or field data that show the correlation between the failure rate and the side joint length? Thankfully, Mordechai Kirshenbaum QA Team Manager --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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